Introducing the REDOX^®-Tool from Plasmatreat, an innovative solution designed to meet the highest demands of modern electronics manufacturing. As the industry moves towards miniaturization and higher performance, the challenges posed by oxidized and contaminated metal surfaces become more critical.

High-efficiency surface activation, targeted, selective, environmentally friendly and with long-term stability

In today’s advanced manufacturing processes, pristine surface cleanliness is critical to ensuring quality, durability, and functionality. Even the tiniest residues can compromise adhesion in key applications such as sealing, bonding or coating—potentially jeopardising product performance and reliability.

Openair-Plasma^® in Semiconductor Packaging plasma cleans and activates surfaces inline, quickly and in a controlled manner. In the semiconductor industry in particular, this enables highly particle-free process control, which reduces waste and increases quality. In addition to perfect adhesion and optimal wettability, service life and product stability also benefit: interface failures such as delamination (IDM) or internal cracking (CCM) can be significantly minimized through targeted plasma pretreatment.

All different types of materials like plastic, glass, metal, aluminum, PET film, textiles, etc. can be coated with PlasmaPlus®. Plasma polymerization with the PlasmaPlus® process is already being used successfully for surface coating in a large number of different industrial applications.

Printed circuit boards (PCBs) are found in virtually all modern electronic devices, serving as the backbone for connecting and routing components within electronic circuits. As these components are increasingly exposed to harsh environments, the demand for effective corrosion protection continues to rise. Whether in vehicle interiors, engine compartments, or critical systems in the aerospace and defense sectors—conformal coatings have become essential to ensure long-term performance and reliability.