Ideal for precise and fast laser depaneling of rigid and flexible printed circuit boards and particularly suitable for applications where high material utilization and low costs are important.

With industry-proven lasers that cover all wavelengths and pulse durations, as well as the option of data transfer with any MES system, the machines in this series offer maximum configuration flexibility and efficiency for your production.

• Laser processes approved by the automotive and medical industries

• Dual-head option for cycle time reduction

• FULL-CUT process for high material utilization, cost savings and environmental compatibility

• Customized automation concepts from small series to large series in 24/7 operation

Perfect for precise and contour-accurate drilling and routing of rigid and flexible PCBs thanks to its solid granite base and state-of-the-art motor technology.

With a flexible platform design that can be customized to your specific requirements and state-of-the-art software, our machines offer maximum precision and efficiency for your production.

• Flexible platform design with customization options for your specific requirements

• Positioning accuracy 10μm @ 3 sigma over the entire machining range

• State-of-the-art software with import options for all common formats  (Gerber, Excellon, ODB, DXF) 

• Automation concepts from small series to large series in 24/7 operation

Ideal for use in the manufacture of ceramic printed circuit boards and particularly suitable for applications where high process speeds and accuracy are required.

High traversing speed combined with very good axis dynamics make the machines in this series stand out.

• Ultra-short pulse laser technology 

• high process speed on all ceramic substrates (i.e. Al2O3, AlN, Si3N4, SiO2, ZrO2, HTCC, LTCC)

• 30μm minimum hole diameter

• Can be extended to several process heads on request

Perfect choice for precise and fast laser trimming of electronic components and circuits and especially suitable for applications where minimum manufacturing tolerances and low costs are required.

Using laser sources with different wavelengths and pulse lengths, the machines in this series offer optimum process results on all thick and thin film materials.

•  Laser sources to suit your requirements

• Fully integrated automation solutions (island or inline)

• Enhanced resistance measurement accuracy with the proprietary high-precision V2000 multimeter

• Extensive scripting options based on C# for the integration of customer-specific logic

Perfect for precise trimming and matching of circuits at wafer level using state-of-the-art laser control and exact positioning systems.

Thanks to modern integration and precise control, the machines in this series guarantee maximum efficiency and accuracy in wafer processing.

• Fully integrated, state-of-the-art laser trimmer and test system for wafer processing

• Control over the laser source enables process consistency with maximum yield

• Advanced image processing and motion systems offer significantly improved positioning options

• Short- or long-pulse laser sources are optionally available