Under the brand name PFDS400® (Preform-based diffusion soldering technology for high temperature applications: above 400 °C), PFARR Stanztechnik offers a revolutionary multi-layer solder range. Using conventional soldering processes with short dwell maximum peak temperatures of 250 °C, these new composite materials produce complete intermetallic phases (IMPs) in the Lead-free solder junctions without pressure or reheating. The resulting structure exhibits a re-melt temperature of over 400 °C.

The composite materials are made from multi-layer systems of tin-based, lead-free solders, together with high melting point metals such as Copper (Cu). The overall thickness ranges from 50 μm to 300 μm. Other alloys and dimensions are available on request.