APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) is a European pilot line dedicated to accelerating innovation in semiconductor technologies through advanced packaging and heterogeneous integration. As part of the European Chips Act initiative, APECS provides companies, research organizations and start-ups with access to state-of-the-art technologies, expertise and services to develop, test and scale next-generation electronic systems. The pilot line combines leading European research capabilities from Fraunhofer and Leibniz institutes, offering solutions in areas such as high-performance packaging, multi-material integration, sensor technologies and advanced semiconductor architectures. APECS supports industry-driven innovation by enabling collaboration across the semiconductor ecosystem – from research and development to industrial applications. Companies and start-ups can benefit from open access opportunities, technology expertise and networking with key players across Europe. We are looking for new partners, innovative companies and start-ups interested in exploring collaboration opportunities, technology development and solutions for future semiconductor applications.